LSW designed major remodeling and renovation projects to upgrade the facility and improve production capability. The process manufactures high-density metal oxide semiconductor (H-MOS) wafers including a photo resistant process. This process requires room space conditions of 68°F DB + 2.0° and 35% relative humidity + 5%. The following modules were included:

Other projects at the Mesa facility involved similar conditions and approximately 15 additional close/ambient control projects. One of these was MEBES work station which maintained 21°C + 0.1°C, or 69.8°F + 0.25°F.

These production facilities were designed to Federal Specification 209B for Class 100 to Class 10 Cleanrooms and comply with the recommended practices of the Institute of Environmental Sciences (IES). Particulate levels of less than 10 PCF are common.

Owner: Motorola
Size: 24,000 SF (total)
Construction Cost: $200-$500/SF